Support us and view this ad

可选:点击以支持我们的网站

免费文章

Sylicom presented SLB chipset DX-T600 and SLM10 module in the meeting. The DX-T600 supports SparkLink Release 1.0 specification, and the SLM10 module support Linux/Android/Harmony/Windows systems with external USB 2.0 interface. They can be used for smart home applications, e.g. wireless projection, smart screen and multi-channel surround sound field, and smart manufacturing applications, e.g. motion control, mobile robot and process monitoring.      Triductor Technology presented SLB chipset TR5510 and SLE chipset TR5312, and development boards in the meeting. They can be used for smart applications in the cabin, home, device and manufacturing.         There are test instruments and systems released in the summit. They are from Starpoint, iTest Technology and HBTE Technologies, respectively.     Starpoint presented SLB integrated test system 9500Pro-SLT and SLB/SLE non-signaling test system SP9020. The 9500Pro-SLT is the first SLB integrated test system in the world, which support test of G node and T node defined by SparkLink specifications. It provides sets of parameter interface to support chip test and development. The SP9020 is a non-signaling test system for both SLB and SLE, which is of functions of PathLoss and self-calibration to provide high accuracy of the device....

继续阅读完整内容

支持我们的网站,请点击查看下方广告

正在加载广告...

Login