CC2564C

德州仪器
0.00
RMB

Overview

具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Bluetooth® 4.2

Features

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Features

BR / EDR / LE, Class 1 TX Power, LE Link Layer Topology, LE Secure Connections, Assisted A2DP/HFP 1.6

Block Diagram

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Application Note

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Development Board

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Core Type

Proprietary

CPU Clock Speed

__

CPU Architecture

__

CPU Features

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Bluetooth Version

Dual-mode Bluetooth

Operating Frequency [Max] (MHz)

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Flash (kB)

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Cache

-

SRAM (kB)

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EEPROM (kB)

__

Debugging

__

Upgrade Type

Manual

Crystal

no

on chip (PLL)

no

crystal (optional)

no

on-chip RC

no

External clock

no

Timers [Number, bits]

no

Real-Time Clock

no

Watchdog timer

no

GPIO

---

Pins

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Pitch

__

Channels

__

ADC [Number, bits]

__

True Random Number Generator

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Analog comp

no

low-power comp

no

Temperature sensor

no

NFC Tag

__

SPI

__

DAC [Number, bits]

__

UART

__

SSI

__

PWM [Number, bits]

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I2C

-

TWI

no

QDEC

-

PDM

-

USB

no

SPI

no

Quad SPI

-

I2S

no

Debug interface

-

Human Machine Interface

-

Programmable channels

__

Fixed channels

__

Channel groups

__

Supply Voltage [Min to Max] (V)

__

no

On-chip VBUS

no

Regulated supply for external components

-

Power fail

no

Crypto Accelerator

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Public Key Hardware Accelerator

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Accelerator

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Security

---

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Current

__

Sensor Controller

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Standby

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Transceiver Compatible

__

Receiver Sensitivity

__

Output Power

__

Frequency Regulation

__

Protocols

-

Bluetooth 5 PHYs

-

bluetooth 5.1 support

-

Dimension

__

Package Type

-

DSP RAM

__

DSP Clock Speed

__

DSP Clock Speed

__

Voice Services

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General

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  • Datasheet: