Extremely low-power premium tier Bluetooth Audio SoC in a WLCSP package, designed for use in compact, voice-supported, feature rich, truly wireless earbuds.

Qualcomm® QCC5151 is a premium tier, ultra-low power, single-chip solution with a programmable DSP, optimized for use in truly wireless earbuds and hearables. QCC5151 is designed to elevate the truly wireless consumer experience with comprehensive support for our audio technologies, robust connectivity, superior battery life and enhanced ear comfort.

Integrated features include Qualcomm® Adaptive Active Noise Cancellation (ANC), voice assistant support (including always-on wake-word activation), Qualcomm® aptX™ Adaptive audio and Qualcomm TrueWireless™ Mirroring technology.

As consumer demand for smaller form factor devices continues to grow, QCC5151’s WLCSP package is designed to help manufacturers develop ultra-small earbuds that are comfortable enough to be worn for long periods of time.

Additionally, the QCC5151 is designed to support the forthcoming Bluetooth Low Energy Audio standard, and helps early-adopting OEMs to develop truly wireless earbuds with the new audio sharing use case.

Additionally, the QCC5151 is designed to support the forthcoming Bluetooth Low Energy Audio standard, and helps early-adopting OEMs to develop truly wireless earbuds with the new audio sharing use case.

Qualcomm TrueWireless? Mirroring
Innovative Qualcomm TrueWireless™ Mirroring technology is designed to deliver a superior user experience by improving robustness and supporting dynamic and seamless bud-to-bud role-swapping with Bluetooth address handover even during run time. True Wireless Mirroring also supports balancing out power distribution between both earbuds.
Support for multiple voice ecosystems
The QCC5151 offers support for push button and wake word activated digital assistants, for multiple ecosystems. This can help to accelerate commercialization of voice-activated products and reduce integration and development time for device manufacturers by combining local voice recognition algorithms running on the Bluetooth audio platform with cloud services running on a mobile application.
Support for Bluetooth Low Energy Audio
Designed to support the forthcoming LE Audio standard and new user experiences with end-to-end operability from smartphone to earbuds. This SoC is designed to help early-adopting manufacturers develop truly wireless earbuds that deliver the audio sharing use cases supported by the exciting LE Audio standard.
Wide range of differentiating audio features
Differentiate at a range of consumer price points with increased choice from Qualcomm’s portfolio of licensable audio technologies , including Comprehensively programmable DSP, Voice service support with Always-on Wakeup Word activation or button press activation, Qualcomm Adaptive Active Noise Cancellation, aptX Adaptive at up to 96Khz audio resolution, aptX Voice, and Qualcomm? cVc? Echo Cancellation and Noise Suppression.

Specifications
Bluetooth

Bluetooth Version: Bluetooth 5.2 Qualified

Bluetooth Technology: BR, EDR, Bluetooth Low Energy, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbps, 3 Mbps

CPU

CPU Clock Speed: Up to 80 MHz

CPU Features: Programmable Apps CPU

CPU Architecture: 32-bit

DSP

DSP RAM: 112kB ( P ) + 448kB ( D )

DSP Technology: 1x Qualcomm Kalimba DSP, Programmable DSP

DSP Clock Speed: 2x 120 MHz DSP

Qualcomm FastConnect Subsystem

Bluetooth Features: Bluetooth 5.2

Support for Voice Services

Digital Assistant Activation: Button press, Always on voice wake-word support

General Audio

Audio Technology: Qualcomm TrueWireless Mirroring technology, Qualcomm Adaptive Active Noise Cancellation, Qualcomm Active Noise Cancellation, Qualcomm aptX audio technology, Qualcomm cVc audio technology

Qualcomm aptX audio playback support: Qualcomm aptX Voice, Qualcomm aptX Adaptive

Voice Services Support: Amazon Alexa Voice Service, Google Assistant

Qualcomm Active Noise Cancelling (ANC) technology: Feedback, Adaptive, Feedforward, Hybrid

Qualcomm cVc Echo Cancellation and Noise Suppression (ECNS) technology: 2-mic Headset, 1-mic Headset

Audio Inputs: 2-ch 101dBA line inputs (single ended)

Audio Interfaces: 1x USB interface supports up to 12Mbps

Audio Playback

PCM, Playback: Up to 192kHz/24bit

Playback DAC: Stereo DAC

Channel output: Mono

Audio outputs: 3x 24-bit SPDIF up to 192 kHz, 2-ch 99dBA Class-D headset, 2-ch 101dBA Class-AB

Power Consumption

Amperage: <5 mA

Interface

Supported Interfaces: 24-bit audio interfaces

Package

Package Type: WLCSP

Pins: 94 pins

Pitch: 0.4mm Pitch

Digital Assistant Activation: Button press, Always on voice wake-word support

Extremely low-power performance

Designed to support the forthcoming Bluetooth LE Audio standard

Bluetooth 5.2 radio

Ultra-small form factor

Powerful quad-core processor architecture – supporting complex use cases

Dual core 32-bit processor application subsystem (up to 80MHz)
Dual core 120Mhz programmable Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)
Qualcomm TrueWireless™ Mirroring technology for improved robustness and a superior user experience

Designed to support wake-word and/or button activated digital assistants including Amazon Alexa Voice Service and Google Assistant

Support for Google Fast Pair

Software architecture compatible with Qualcomm® QCC512x and Qualcomm® QCC514x series

Embedded ROM + RAM and external Q-SPI Flash

Connectivity to external SRAM or 2nd Flash Device

On-chip memory for audio buffering

High-performance audio combined with low-power consumption

Support for aptX Voice superior for call quality on uplink and downlink
Support for 24bit/96kHz high resolution audio
Support for Qualcomm® aptX™ audio including aptX Adaptive
8th generation Qualcomm® cVc™ Echo Cancelling and Noise Suppression

Support for Qualcomm® Adaptive Active Noise Cancellation - feedforward, feedback, hybrid and adaptive

Support for 3rd party innovation via the Qualcomm® Extension program

BR / EDR / LE