Manufacture
Cypress Semiconductor
赛普拉斯公司总部位于美国硅谷,于世界各主要城市设有销售中心。公司主要生产PSoC, USB, Clock,Memory等产品,并正在有计划的扩张产品线,旨在为全球通讯产品提供品质优良的芯片和解决方案。
china.cypress.com
美国
赛普拉斯
Chips
ARM Cortex®-M4
支持
no
no
-
96 MHz
-95 dBm for BLE 1 M
Over-the-air (OTA) firmware updates
-
no
CYW20819
256
支持
Programmable TX Power up to +4 dBm
BR / EDR / LE
no
蓝牙低功耗, 蓝牙双模
5.2
支持
no
赛普拉斯
Real-time clock (RTC)
no
-
美国
watchdog timers (WDT)
no
BR, EDR 2 Mbps and 3 Mbps, eSCO, BLE, and LE 2 Mbps
Two Quad-SPI interfaces
-
-
CYW20819 Ultra Low Power, BLE/BR/EDR Bluetooth 5.0 SoC
Bluetooth stack in ROM allowing standalone operation without any external MCU
Programmable key scan 20 x 8 matrix
Three-axis quadrature signal decoder
 
 
 
40
-
128-bit AES, True Random Number Generator (TRNG)
The CYW20819 is a Bluetooth® 5.2 single-chip solution targeted at Bluetooth Mesh, audio, voice, wearables, mice, keyboards, gaming consoles, remote controls, home automation, and a wide range of other Internet of Things (IoT) applications. The CYW20819 fully implements the Bluetooth Mesh 1.0 specification, and employs the highest level of integration to eliminate external components, allowing device makers to reduce product footprints and decrease overall system costs.

The CYW20819 integrates Ultra-Low Power (ULP) BLE along with the capability to add audio functionality to enhance the user experience for wearables and trackers. It also provides best-in-class receiver sensitivity for both BLE and EDR. Using advanced design techniques and process technology to reduce active and idle power, the CYW20819 also addresses the needs of a diverse class of low power Bluetooth 5.2-enabled devices that require minimal power consumption and compact size The device is intended for use in audio (source only, other than SCO), IoT, sensors (medical, home, security and industrial), and HID markets.
True Random Number Generator (TRNG)
no
Two Quad-SPI interfaces
176
-
-
Security functions in ROM including ECDSA signature verification
-
no
no
no
-
Auxiliary ADC with up to 28 analog channels
0.00
¥
0
 
no
no
-
no
ARM Cortex-R4
no
no
Wi-Fi 6/6E
  • 支持
Manual
FCGBA, WLCSP
no
CYW5557x
-
LE Audio, SCO, eSCO, Direction finding AoA/AoD, LE- 2Mbps, Long Range , Advertising Extensions
no
  • 支持
蓝牙低功耗+Wifi
5.2
支持
no
英飞凌
no
no
-
no
no
-
-
Yes

Infineon’s AIROC™ CYW5557x is a highly integrated Wi-Fi 6 / 6E and Bluetooth 5.2 SoC family. CYW5557x supports Wi-Fi 6 / 6E features and is Tri-band capable (2.4G, 5G, 6G). It is available in both 2x2 or 1x1 configurations. 5557x brings exceptional high quality video/audio streaming and seamless gaming experience in congested network environment and significantly reduces latency by operating in 6G spectrum.

The Infineon AIROC™ CYW5557x has enhancements to improve range, power efficiency, network robustness , and security. It is highly integrated with an on-chip power management unit, power amplifiers and low noise amplifiers to reduce total BOM cost and board space.

  • CYW55573: Wi-Fi 6E, 2x2

  • CYW55572: Wi-Fi 6, 2x2

  • CYW55571: Wi-Fi 6E, 1x1 (80MHz)

Wi-Fi Features

  • Wi-Fi 6/6E, Tri-band (2.4/5/6 GHz)

  • OFDMA, MU-MIMO, TWT, DCM

  • 2x2 MIMO or 1x1 SISO

  • 20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate

  • STA and Soft AP mode

  • Enhanced range, power savings, network efficiency features

  • Zero-wait DFS

15
-
Secure Boot, WPA3, FW authentication and encryption, Lifecycle management, Anti-rollback protection
Bluetooth 5.2, 5.1, 5.0: All optional features
.LE Audio
.LE- 2Mbps, Long Range , Advertising Extensions
.Direction finding AoA/AoD
.SCO and eSCO
no
no
  • Gaming

  • Smart speaker

  • Voice Assist system

  • AR/VR

  • Digital Camera

  • Security system

  • Industrial gateway

  • AI enabled

-
-
-
no
no
no
-
0.00
¥
0
 
no
-40℃ ~ 85℃
no
-
no
ARM Cortex®-M3
Wifi 频段:3频段 (2.4GHz, 5GHz 和 6GHz);WiFi PHY 数据速率:1.2Gbps;Driver Support:Linux, Android
no
no
802.11 a/b/g/n/ac/ax
Manual
-
no
CYW89570
-
BR / EDR / LE
no
蓝牙低功耗+Wifi
5.2
no
no
英飞凌
no
no
-
no
no
-
-
-

The AIROC™ automotive portfolio of industry-leading Wi-Fi® and Bluetooth® combo solutions power the Infotainment and Telematics systems in today's connected cars. AIROC™ automotive connectivity solutions allow drivers and passengers to easily sync and stream content from mobile devices to the car's infotainment system and rear-seat displays, while enabling high-speed connectivity beyond the vehicle.

Infineon’s pioneering Real Simultaneous Dual Band (RSDB) solutions provide simultaneous operation in both 2.4GHz and 5GHz bands as well as Multiple-Input Multiple-Output (MIMO) support. RSDB solutions provide the necessary bandwidth and the software architecture required to support complex use-case scenarios for cars, enabling combinations of AP, Station, and P2P connections simultaneously. This allows Automakers to support several simultaneous application scenarios: Driver and passenger devices streaming high-bandwidth data and media content, mirroring phone/tablet displays (Apple CarPlay, Android Auto, and Mirrorlink), and external Wi-Fi hot-spot access for on-the-go connectivity without relying on cellular data service. All this while using Bluetooth hands-free calling with the integrated Bluetooth technology that provides coexistence support for shared Wi-Fi and Bluetooth operation in 2.4GHz band.

Automakers can leverage in-car Wi-Fi to deliver software upgrades and new features. Drivers can use a mobile device to check remotely on their car's location, gas levels and mileage. The same device can receive alerts about vehicle performance and diagnostics.

Wi-Fi is the communication technology for Electric Vehicle (EV) charging infrastructure, both for optimizing energy-transfer from the electric grid to cars and to facilitate convenient payment systems for car battery charging.

The AIROC™ automotive-qualified Bluetooth devices enable connectivity between the car and the latest mobile devices and wearable gadgets. Support for Bluetooth's Enhanced Data Rate (EDR) enables best-in-class wireless audio for hands-free calling and Advanced Audio Distribution Profile (A2DP) music streaming between a mobile device and the vehicle infotainment radio system. The portfolio supports narrow band and newer wide band speech capabilities with a variety of SmartAudio™ algorithms, including packet loss concealment and bit error correction. Bluetooth technology also enables drivers to use their smartphones to adjust seat, temperature, and infotainment settings while providing vital data on automotive performance and diagnostics.

All automotive qualified, Bluetooth devices offer an industry-standard Host Controller Interface (HCI) and can be used with almost any Bluetooth stack, operating system and host processor.

Integrated Power Amplifier (PA)

Power Management Unit with Buck-Mode Switching Regulator

2 and 3 antenna support

-
AES engine, WPA/WPA2/WPA3 Enterprise, WAPI STA Network Security, AES encryption/decryption with TKIP and IEEE 802.1x support, WPS, 802.11i
no
no
automotive qualified, AIROC™ Wi-Fi & combo and Bluetooth solutions.:
Driving the Connected Car Revolution
-
-
-
no
no
no
-
0.00
¥
0
 
no
-40 to 85°C
no
-
no
ARM Cortex-M3
no
no
-
-93.5 dBm
Manual
-
no
CYW20706
848
-
12 dBm (BR) class 1 & 2
BR / EDR / LE
no
蓝牙芯片, 蓝牙低功耗
4.2
no
no
4
赛普拉斯
352
no
no
-
no
no
-
-
Yes

The Cypress CYW20706 is a single-chip Bluetooth® 5.0-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver. Manufactured using the industry's most advanced 40 nm CMOS low-power process, the CYW20706 employs the highest level of integration to eliminate all critical external components, thereby minimizing the device's footprint and the costs associated with implementing Bluetooth solutions.

The CYW20706 is the optimal solution for embedded and IoT applications. Built-in firmware adheres to the Bluetooth Low Energy (BLE) profile.

(The Cypress CYW20706 is a single-chip Bluetooth 4.2-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver)

Microcontroller

  • Arm® Cortex®-M3 32-bit RISC processor with

  • Embedded ICE-RT debug and SWD interface units

  • 840-KB on-chip RAM

Peripherals

  • Up to 24 GPIOs

  • I2C, I2S, UART, and PCM interfaces

  • Support for EEPROM and serial flash interfaces

  • Integrated low dropout regulators (LDO)

24
-
Complies with Bluetooth Core Specification version 5.0

Includes support for BR, EDR, and BLE

LE data rate up to 2 Mbps

BLE HID profile 1.00 compliant
no
no
840
-
-
CYW920706WCDEVAL
-
no
no
no
4
-
0.00
¥
0
 
no
no
-
no