Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its wireless portfolio of high-performance, reliable and secure offerings. The newly developed AIROC™ brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for the IoT, enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The Wi-Fi 6/6E combo solutions operate in the 2.4 GHz, 5 GHz, and the new, greenfield 6 GHz spectrum to deliver robust performance and minimal latency. This makes them ideal for high-quality video and audio streaming applications like gaming consoles, AR/VR, smart speakers, media-streaming devices and automotive Infotainment. Applications that require an instant response – like security systems and industrial automation – will also benefit from Infineon’s new products.

2020年12月17日,中科蓝讯CEO刘助展先生和北京声加科技CEO邱锋海先生联合发布了“讯龙二代”蓝牙SoC芯片。“讯龙二代”芯片在功耗、射频、ANC、AI等领域,性能都有了极大的提升,特别的,该芯片集成了声加科技的ENC算法。
中芯国际的28nm、14nm、12nm、N+1等技术均已进入规模量产,7nm技术开发已经完成,今年4月可以进入风险量产。
  • The company’s Wi-Fi and Wi-Fi/Bluetooth combo solutions are pre-integrated across its i.MX RT MCU platform, allowing developers to create the optimal pairing of processing with connectivity
  • NXP combines its MCU and Wi-Fi/Bluetooth platform solutions within its MCUXpresso Software Development Kit (SDK) to simplify and accelerate IoT product development
  • Connectivity modules and MCU development kits are available now through NXP’s extensive distribution network
  • Company introduces new 2x2 Wi-Fi 6 Dual Band + Bluetooth / Bluetooth Low Energy (BLE) solution that brings 1.2 Gbps performance, low power, and greater range to IoT markets.
  • Family of products deliver new levels of connectivity and power the world’s first Wi-Fi 6 enabled gaming consoles

RSL10 SIP 是将业界最低功耗的蓝牙低功耗技术用于无线应用的最简便方案。

RSL10 SIP 通过了蓝牙 5 认证,完全符合全球无线标准,采用了无需任何额外天线的设计,可显著缩短产品上市时间。

即用型 RSL10 SIP 将集成式天线、RSL10 无线电 SoC 和所有无源组件整合在一个微型封装内。

 
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时间:2020年11月18日  14:00~17:00

出奇长的产业链,芯片、终端、网络、平台、应用多领域,50多种物联网开发硬件,至今没有被统一的十几种物联网协议。海量物联网终端,多场景、多需求应用,搭载不同物联网技术

如NB-IoT、LoRa、ZigBee、Bluetooth、WiFi、5G、GPS,北斗,安装在不同的使用环境,使得物联网设备在研发和测试过程中面临着各种挑战。

由是德科技发起,邀请到中微半导体(深圳)股份有限公司、u-blox公司联合一起,围绕物联网低功耗MCU、蓝牙模块、低功耗测试,为大家详细剖析物联网低功耗的研发重点及应用考虑。

Thursday, 22 October 2020 09:41

2020世界智能网联汽车大会

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时间:2020年11月11日-13日                      
地点:北京-中国国际展览中心新馆
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