New Products - bluetooth蓝牙技术

Published in Bluetooth chips

ON Semiconductor RSL10 SIP:通过蓝牙 5 认证的系统级封装

RSL10 SIP 是将业界最低功耗的蓝牙低功耗技术用于无线应用的最简便方案。

RSL10 SIP 通过了蓝牙 5 认证，完全符合全球无线标准，采用了无需任何额外天线的设计，可显著缩短产品上市时间。

即用型 RSL10 SIP 将集成式天线、RSL10 无线电 SoC 和所有无源组件整合在一个微型封装内。

ST BlueNRG-LP:Programmable Bluetooth® Low Energy Wireless SoC

The BlueNRG-LP is an ultra-low power programmable Bluetooth® Low Energy wireless SoC solution. It embeds STMicroelectronics’s state-of-art 2.4 GHz RF radio IPs combining unparalleled performance with extremely long-battery lifetime. It is compliant with Bluetooth® Low Energy SIG core specification version 5.2 addressing point-to-point connectivity and Bluetooth Mesh networking and allows large-scale device networks to be established in a reliable way. The BlueNRG-LP is also suitable for 2.4 GHz proprietary radio wireless communication to address ultra-low latency applications.

Renesas:IoT Sensor Board with Machine Learning & Bluetooth® Low Energy

Published in Bluetooth modules

Blue Star 30 September 2020

Renesas:IoT Sensor Board with Machine Learning & Bluetooth® Low Energy

This is a reference design for a versatile Internet of Things (IoT) sensor board solution. It targets applications in industrial predictive maintenance, smart home/IoT appliances with gesture recognition, wearables (activity tracking), and mobile for innovative human machine interface, or HMI, (FingerSense) solutions. This reference design was developed with Renesas partner Qeexo, who provided their Automated Machine Learning platform (AutoML) for edge devices.

Tagged under

Ti SimpleLink™ CC2640R2L Flash-based wireless MCU

Connectivity overview

Expanded portfolio of wireless connectivity devices across scalable memory and performance options.

Arm® Cortex® architecture

32kB to 352KB flash memory

20kB to 80kB SRAM with pin-to-pin compatibility

Across wireless connectivity protocols

Supporting a broad range of Bluetooth® Coded PHY, 2MB PHY, Extended advertising, Bluetooth Low Energy 5.1,Locationing, Mesh, Multiprotocol

Quarterly SDK releases with latest Bluetooth Low Energy features

Scalable Scalablefeatures

Integrated sensor controller, precision ADC, PA, coexistence BAW resonator

Radio

• Power output: +5dBm

• -97dBm sensitivity

• Sofware configurable

Published in Bluetooth chips

Renesas Extends Bluetooth 5.0 Connectivity to RA Family of 32-Bit MCUs with Arm Cortex-M Core

Enhanced Security and Privacy for Bluetooth 5.0 Low Energy Connections Supported with Flexible Software Package and Comprehensive Arm Ecosystem.

Renesas Electronics Corporation introduced the first RA microcontroller (MCU) with an integrated Bluetooth® 5.0 Low Energy radio on 07 May 2020. The single-chip RA4W1 MCU includes a 48 MHz, 32-bit Arm® Cortex®-M4 core and Bluetooth 5.0 core delivered in a 56-pin QFN package. Together, the RA4W1 MCU and easy-to-use Flexible Software Package (FSP) enables engineers to immediately begin development with Arm ecosystem software and hardware building blocks that work out-of-the-box with RA MCUs.

The RA4W1 MCU makes it easy for embedded designers to develop safe and secure IoT endpoint devices for Industry 4.0, building automation, metering, healthcare, consumer wearable, and home appliance applications. The MCU is also ideal for developing IoT edge devices for wireless sensor networks, IoT hubs, an add-on to gateways, and an aggregator to IoT cloud applications.